Die Attach Operator – 3rd shift

Summary: Seeking a Die Attach Operator on 3rd shift with experience in microelectronics module assembly and Mil Std 883.

Job Requirements:

• Minimum of 2 years experience in microelectronics module assembly

• HS diploma required

• Ability to set-up, operate, and adjust or learn to run a variety of microelectronic production equipment

• Knowledge of wire-bonding gold wire or ribbon to various die and substrates

• Experience with die attach using solder preforms or epoxy

Preferred Skills:

• Experience working in a cleanroom environment following ESD protocols

Job Responsibilities:

• Work under direction from production schedules, manufacturing procedures, process plans, and instructions

• Operate and set-up manual gold wire bonders and manual eutectic/epoxy die attach systems per micro-circuit layout drawing

• Ensure proper wire formation, bond appearance, and bond strength per Mil Std 883

• Ensure proper die attachment including coverage and die shear strength per Mil Std 883

• Train in multiple Microelectronics processes involving other assembly activities

• Maintain compliance with Mil Standard 883 requirements through detailed production activities and documentation

 

Pay Details: $25.00 to $28.00 per hour

Benefit offerings available for our associates include medical, dental, vision, life insurance, short-term disability, additional voluntary benefits, EAP program, commuter benefits and a 401K plan. Our benefit offerings provide employees the flexibility to choose the type of coverage that meets their individual needs. In addition, our associates may be eligible for paid leave including Paid Sick Leave or any other paid leave required by Federal, State, or local law, as well as Holiday pay where applicable.

Equal Opportunity Employer/Veterans/Disabled

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The Company will consider qualified applicants with arrest and conviction records subject to federal contractor requirements and/or security clearance requirements.